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| NEMI Tin Whiskers Group to Outline Recommendation for Accelerated Test Methods at SMTA International Conference
HERNDON, Va.--(BUSINESS WIRE)--Aug. 26, 2003-- NEMI Roadmap and "Perfect BoM" are also on conference agenda BizVantage – Personalized business, investment or technology Intelligence: the ultimate advantage. The National Electronics Manufacturing Initiative's (NEMI's) Tin Whisker Accelerated Test Project will present its recommendations for tin whisker testing at the SMTA International conference in Chicago (September 21-25). Other NEMI activities that will be discussed at the conference include the latest NEMI roadmap, process and reliability results from NEMI's Lead-Free Assembly Project, and the consortium's recommendations for development of a "Perfect Bill of Materials" (BoM). The need to better understand whisker growth has increased significantly as component suppliers convert from tin-lead (SnPb) finishes to Pb-free finishes of Sn and low-alloy-content Sn-based finishes. Whiskers are tiny metal filaments emanating from the surface finish. The problem is that these whiskers may grow long enough to cause short circuiting or break off and interfere with other devices in an application. Currently, there is no industry-accepted test to assay the propensity of a plating finish to whisker and to estimate the risk of whisker growth for a given plating process. NEMI's Tin Whisker Accelerated Test Project, formed in 2001, has evaluated different environmental factors influencing whisker growth. Based on the results of these investigations, NEMI is recommending three tests (two storage conditions and one temperature cycle condition) to help determine the whisker growth propensity of plating finishes. NEMI is also coordinating closely with JEITA (in Japan) and SOLDERTEC (in the U.K.) to define testing parameters. The recommendations will be submitted to JEDEC, the Solid State Technology Association (formerly known as the Joint Electronic Device Engineering Council), for release. For additional information about NEMI's tin whisker activities, including interim reports from the Tin Whisker Modeling Project and Tin Whisker User Group, visit: http://www.nemi.org/projects/ese/tin_whisker.html The schedule of NEMI presentations at SMTA International is as
follows:
Conference Session NEMI Presentation Date/Time/Location
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Contract Manufacturing In Search of Monday, September 22
Symposium (EMS1) the Perfect BoM 8:30 - 10:00 a.m.,
Room 25 (upper level)
Smart EMS: Knowledge is
Power - and Money!
(panel)
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Free session (open to NEMI Technology Wednesday, September 24
all attendees) Roadmaps - Guides 10:30 am - 12:00 pm,
For Manufacturing Room 1
Competitiveness
in a Changing
World's Electronics
Environment
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Lead-Free Soldering NEMI Lead-Free Thursday, September 25
Technology Symposium Assembly Project: 8:30 am - 10:00 am,
(SOL1) Processing and Room 1
Reliability Results
Pb-Free and Sn
Whiskers Consortia
Activities (panel) NEMI Tin Whisker
Accelerated Test
Project: Tin Whisker
Test Method Standards
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About NEMI The National Electronics Manufacturing Initiative's mission is to facilitate leadership of the North American electronics manufacturing supply chain. Based in Herndon, Va., the industry-led consortium is made up of approximately 70 electronics manufacturers, suppliers, industry associations and consortia, government agencies and universities. NEMI roadmaps the needs of the North American electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. For additional information about NEMI, visit www.nemi.org.
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